GIGABYTE Unleashes the Power of AMD Ryzen™ 9000 Series at CES 2026

At CES 2026, GIGABYTE showcased how it is maximizing the performance of the latest AMD Ryzen™ 9000 Series processors with AMD 3D V-Cache technology. At the center of this push is the company’s exclusive AI-powered X3D Turbo Mode 2.0, designed to deliver real-time, adaptive performance tuning that takes X3D CPUs beyond their traditional limits.

Unlike standard overclocking tools, X3D Turbo Mode 2.0 represents a true hardware-and-software fusion. Trained using massive real-world datasets, the system intelligently adjusts performance based on workload demands. Fully optimized for the newest X3D-powered Ryzen™ 9000 Series processors, it is ready to deliver enhanced performance right out of the box.

Flagship Performance with the X870E AORUS XTREME X3D AI TOP

Leading the lineup is the flagship X870E AORUS XTREME X3D AI TOP motherboard, engineered for users who demand uncompromising performance. It supports ultra-fast DDR5 memory speeds of up to 9000+ MT/s, providing exceptional bandwidth and stability for high-performance computing and gaming.

Thermal management is another key highlight. The advanced CPU Thermal Matrix design reduces VRM and DDR temperatures by up to 8.5°C, while the DDR Wind Blade XTREME further lowers memory module temperatures by up to 9°C. For storage, the M.2 Thermal Guard XTREME helps keep SSD temperatures in check, cutting heat by up to 22°C to maintain consistent speed and long-term reliability under heavy workloads.

Style Meets Functionality

Beyond raw performance, GIGABYTE also introduced design-forward and builder-friendly options to appeal to a broader range of PC enthusiasts.

The X870E AERO X3D WOOD stands out with its warm wood-grain textures, refined leather pull tabs, and carefully crafted details—bringing a natural, modern aesthetic to PC builds.

Meanwhile, GIGABYTE expanded its PROJECT STEALTH series with sleek black versions of the X870 and B850 AORUS STEALTH motherboards. These models feature a reverse-connector layout, moving cables to the back of the board for a cleaner, cable-free look and a smoother assembly experience. The design gives gamers and creators greater flexibility to showcase their builds without visual clutter.

Experience GIGABYTE at CES 2026

GIGABYTE’s CES 2026 showcase went beyond just new hardware, highlighting its vision for AI-enhanced performance and user-centric design.

Visitors could explore the full lineup at Booth #8519 in the LVCC North Hall. Media and VIP attendees were also invited to exclusive sessions at the Venetian Ballroom, Level 3 (Lido 3004, 3005, and 3104).

With AI-driven optimization, advanced cooling innovations, and bold new design directions, GIGABYTE demonstrated at CES 2026 that the next era of high-performance PC building is already here.

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