
Vertiv, a global leader in digital infrastructure and continuity solutions, recently concluded its highly successful Masterclass at Shangri-La the Fort, Manila, on September 25th. This event gathered over 100 data center infrastructure engineers, designers, consultants, and contractors for a day of engaging discussions, interactive sessions, and expert-led panels on managing the complexities of high-density Artificial Intelligence (AI) deployments.
The Vertiv Masterclass is an annual series of advanced learning sessions designed to refresh knowledge on the latest advancements in power protection, thermal management, and other critical infrastructure components. These sessions allowed consulting engineers and infrastructure designers the opportunity to engage in interactive discussions and benefit from technical presentations that cover vital industry developments.
This yearâs masterclass placed a special focus on the increasing demands of AI and the challenges posed by high-density, high-performance compute deployments. Sales Director of Vertiv Philippines Pamela Albar and Director of Distribution and Longtail Business at Vertiv Asia Joe Thomas, delivered keynote presentations underscoring AIâs profound impact on critical infrastructure and how Vertivâs portfolio of solutions, including the Vertiv⢠360AI, is positioned to support these evolving needs.
âAI is power-intensive and requires higher-density racks to meet its demands. Consequently, data centers must adapt to the increased usage of heat, energy, and workloads generated by AI. This is where Vertiv comes in. Vertiv is ready for AI, and we aim to help organizations and hyperscalers in the country achieve their potential and win the AI tech race,â said Albar.
Consequently, Michael Sinocruz, Director of the Energy Policy and Planning Bureau (EPPB) at the Department of Energy (DOE), and Engr. Edwin Raganit, President of ASHRAE Philippines, also provided key insights during the presentations. They discussed the energy challenges posed by AI and the necessary steps to address them, adding depth to the discussions.
A major highlight of the event was the industry panel discussion, industry tech leaders talked about overcoming the real-world complexities of high-density AI deployments. Moderated by Senior Manager of Strategic Marketing at Vertiv Asia Reinier Dungca, the panel featured President and CEO of ST Telemedia Global Data Centers (Philippines) Carlo Malana, Co-Founder and Board Member of the Data Center Association of the Philippines (DCAP) Steven Davis, Product Manager at Vertiv Simon Brady, and President and CEO of ePLDT and Vitro Inc. Victor Genuino.
The panel offered valuable insights into AI deployments in the Philippines, the challenges of high-performance computing, and the technologies available to address these issues. They also emphasized how support from organizations and their people can drive infrastructure growth capable of handling AI deployments.
âWhile infrastructure is a high priority, we also need to focus on the people running these systemsâthose with the talent and skills to help build future data centers that benefit stakeholders. Itâs really about how organizations can provide support so we can remain competitive. The future is now,â said Malana.
The afternoon session saw attendees participate in focused mechanical and electrical tracks, with breakout discussions on high-density power distribution, liquid cooling, and the Vertiv AI reference design.
âThe remarkable turnout for this yearâs Vertiv Masterclass demonstrates the growing criticality of AI and its widespread impact on critical infrastructure and organizations. Itâs inspiring to see so much enthusiasm from our peers, eager to learn about todayâs available technologies and solutions to support high-performance deployments. We extend our gratitude to our partners, attendees, and experts for sharing their insights and best practices,â said Danny Wong, Senior Director of Global and Regional Key Accounts at Vertiv.
For more information on Vertiv and its AI-ready solutions, visit Vertiv.com.
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